Sony CMD-J26 Bedienungsanleitung PDF herunterladen (Seite 18)

FLEX-BOARD

BLOCK

DGND

CHG

GEN I/O

POWER OUT

RX (IN)

TX (OUT)

ACC ID

RTS

9 CTS

AUDIO OUT

AUDIO IN

AGND

SIM I/F

HFK I/F

SIM LEVEL

CTRL 3V/5V

A/D CONV RF I/F A/D, D/A

SIM

Connector

Battery

Connector

KEY-LED

LCD-LED

KEY-MATRIX

SLIDE-SW

(REC/LOCK

or Manner

)

*Ringer

*Vibrator

*Loud-

Speaker

MIC

32kHz

CLK-

CTRL

RTC / ID

SIM CARD

IC 1

FLASH/SRAM

LCD

SIM

Interface

MCP-I/F

KEY-I/F

HEADPHONE-JACK

JOG-I/F

RF-I/F

MODEM-I/F

LCD-I/F

TIME

PROCCESSING

UNIT

RTC

IC 2

I/F

AUDIO

AMP

I/O CONNECTOR

AUDIO

I/F

MIC

KEYBOARD

JOG DIAL

AUDIO

AMP

HEADSET

AUDIO &

REMOTE

RINGER

JOG

Power / CHG

Management

IC 1

I/F

EAR

RECEIVER

LI-ION

BATTERY

TCXO

IC 2

Multiactor

BL-I/F

6.2 Baseband Block Diagram

6.2.1 General

The Baseband part consists of two chips, a digital chip IC 1 and an analog one IC 2.

The CMD-J6/J26 external memory size is 32 Mbits Flash ROM and 4 Mbit SRAM.

IC 1

The application of IC 1 is the management of the GSM baseband processes through the GSM layer 1, 2 and 3

protocols as described in the ETSI standard with a specific attention to the power consumption in both GSM

dedicated and idle modes.

It is a chip that implements:

! the digital baseband processes of the CMD-J6/J26 and combines a Digital Signal Processing (DSP) with its

program and data memories,

! a Micro-Controller core with emulation facilities and an internal RAM memory,

! a clock squarer cell,

! several compiled ports and equivalent CMOS gates.

Full support for Full-Rate, Enhanced Full-Rate and Half-Rate speech coding is given.

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